Analysis of Thermally Grown Oxides on Microperforated Copper Sheets

Abstract Copper oxides have some interesting photocatalytic properties and reasonably low price which makes them applicable as PN transistors. However, to obtain the best performance it is necessary increase specific working surface of materials plays a key role in many applications. Furthermore, by ordered spacing heterojunction formation possible fabricate systems with dedicated properties, like for example photovoltaic junction. The conducted research analyses mechanical stress distributions, thermal stability metal–oxide structures such advanced geometries. Micro-perforation thin Cu sheet was selected study, can both enhance free substrate decrease number sites occurrence. Both Cu-Cu 2 O Cu-CuO layers were simulated using finite element analysis. model based on fixed geometry square shaped samples dimensions 156 × mm applied metal plates holes-patterned covered top 1-3 μm thick oxide layers. On other hand, influence plate thickness found be important terms structure durability. A good agreement between simulation experimental data achieved. critical delamination temperature c.a. 473-483 K estimated verification simulation/computation done analyzing perforated non-perforated Electrolytic Tough Pitch (ETP) sheets. Two methods, FIB-TEM scan profilometer, selected. first verified decohesion coatings from support after exceeding 523 issue that also noticed susceptibility peeling inner holes.